From research to application.
Supported by the research and industrialisation ecosystem of NIII in Ningbo.
Visit NIIICooling infrastructurefor AI computing.
Connecting materials, modules and systems through phase-change storage and micro- and nanoencapsulation, bringing thermal management into high-density computing.
PHASE CHANGE MATERIAL / PCM
Micro- and nanoencapsulation for thermal management.
PCM stores and releases heat. UltraST composites and MOF-catalyzed microencapsulation bring that capability into modules, enclosures and functional substrates.
Research & quality
PCM quality, backed by certification.
Passive Edge is a Quality Association PCM (RAL) member. PE-O-5 has earned the RAL Quality Mark.
Two technology platforms. Three ways to collaborate.
From material performance to system capability.
Material supply
Phase change materials
Phase-change materials matched to your temperatures and operating conditions.
Browse materials
System integration
Storage modules & enclosures
From PCM plates and thermal cores to complete storage enclosures.
Explore modules & enclosures
Custom development
Custom development
Joint development of core materials, encapsulation and interfaces.
Explore custom developmentWhere can the materials work?
Select a scene to explore its application.
News & projects
Research, testing and projects in practice. A clear record of how the technology develops.
View all newsGlobal applications
Serving the world.Building a thermal response network.
Materials and engineering connect thermal needs across regions.
Customer sectors
- Data centres
- Building HVAC
- Cold-chain logistics
- Biomedical equipment
- Energy storage
Tell us what you need.
Start with a temperature problem, a material need or a collaboration idea. You can get in touch before technical details are known.
Discuss a collaboration